motherboard position and plan soldering paste platform
motherboard position and plan soldering paste platform
motherboard position and plan soldering paste platform
  • motherboard position and plan soldering paste platform
  • motherboard position and plan soldering paste platform
  • motherboard position and plan soldering paste platform

MECHANIC motherboard position and plan soldering paste platform

sku:I BGA 13 MAX

Support 

IP 13/13mini/13 Pro/13 Pro Max

IP 12 Mini/12 Pro Max12 Pro/12

IP 11 Pro Max/11 Pro/11

IP XS Max/XS/X

Motherboard middle layer positioning tin planting

tag:

Stencils for the mid-level motherboard

Support IP 13/13mini/13 Pro/13 Pro Max/12 Mini/12 Pro Max

12 Pro/12/11 Pro Max/11 Pro/11/XS Max/XS/X




Double-sided positioning

One set of tools can complete the repair


Double-sided positioning structure design

High-precision motherboard positioning, not loose


Strong magnetic adsorption

High-precision positioning

Magnetic positioning function, with precise positioning

Close fit, easy to align the holes


High quality steel

Imported special grade materials

High-quality imported special-grade steel square round hole design

High temperature resistance 500℃ effectively prevent steel mesh from bulging


Plant tin off the stencil

The solder balls are full

planted tin off the stencil and integrated molding,

Use a heat gun to heat and blow until the solder paste melts



14 in 1

Make motherboard repair 

more comprehensive

Support IP 13/13mini/13 Pro/13 Pro Max/12 Mini/12 Pro Max

12 Pro/12/11 Pro Max/11 Pro/11/XS Max/XS/X

Motherboard middle layer positioning tin planting


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